The head of TSMC’s (TSMC) open innovation platform recently announced that he has joined Intel as vice president of ecosystem development, which has attracted attention. It is estimated that Intel intends to follow TSMC’s open innovation platform architecture to increase market competitiveness.
Suk Lee, who used to be the head of the open innovation platform at TSMC (TSMC), recently announced on Linkedin that he will join Intel as the vice president of ecosystem development business, which has attracted public attention. Korean Suk Lee has worked for TSMC for 13 years. He worked in TSMC’s US branch in his early years before moving to TSMC’s headquarters in Hsinchu, Taiwan.
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The open innovation platform is a complete design technology framework, covering all key integrated circuit design areas, effectively reducing various obstacles that may be encountered during design, and improving the chance of success in the first production.
The open innovation platform will also combine the semiconductor design industry, TSMC’s design ecosystem partners, TSMC’s silicon intellectual property (IP), design applications, design for manufacturability services, process technology, and back-end packaging and testing services to bring the most Time-sensitive innovation.
Intel also announced the establishment of the IFS Cloud Alliance earlier, which will improve the design efficiency of foundry customers through massive on-demand computing, so that products can be launched safely and quickly, and will work with partners to enhance the advantages of EDA and Meets the requirements of the Intel Process Design Suite, allowing designers to handle more workloads, ensuring resource management, time-to-market and quality of results.
Therefore, it is estimated that the addition of Suk Lee will help Intel to follow the example of TSMC’s open innovation platform architecture to establish a complete foundry ecosystem and increase its competitiveness.